● Wafer BSG:
Wafer size: 12 inch
Wafer thickness: min 30um
BSG thickness tolerance: +/-3um
● Wafer Dicing:
Dicing method: Blade, Laser
● Die Bonding
Die Size: min 0.2mm*0.2mm
Adhesive materials: Glue, DAF, FOW
Die stack capability: 2D, 4D, 8D, 16D
Die Bonding accuracy: +/-15um
● Wire Bonding
Bond pad pitch: min 45um
Bond pad size: min 40um
Wire loop: min 30um
Gold wire diameter: 15um, 17.5um, 20um
Silver wire diameter: 17.5um, 19um
Wire Bonding accuracy: +/-2um
● Molding: Transfer Molding and Compression Molding
Mold Cap height: 300um to 1000um
● Laser Marking:
Marking type: green laser and red laser
Marking depth: max 50um
2D marking capability to the individual IC
● Ball Mounting:
Ball pitch：min 0.3 mm
Ball size：min 0.2 mm
